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Microsystems Technology Office (MTO) Office-wide

DOD-DARPA-MTO

Status:

Active

March 16, 2022

Posted:

Deadline: 

March 16, 2024

Funding

Program:

Award Floor:

Ceiling:

Match Required?

No

Eligibility

All

States:

Entity Types:

State governments, County governments, City or township governments, Special district governments

All responsible sources capable of satisfying the Government's needs may submit a proposal that shall be considered by DARPA. See the Eligibility Information section of the BAA for more information.

Contact

Email:

Phone:

Source Type:

Federal

This announcement seeks revolutionary research ideas for topics not being addressed by ongoing MTO programs or other published solicitations. MTO seeks to develop high-risk, high-reward technologies that continue DARPA’s mission of creating and preventing strategic surprise, help to secure the Department of Defense’s (DoD) technological superiority, and address the complex threats facing U.S. national security. Proposed research should investigate innovative approaches that enable revolutionary advances in science, devices, or systems. Specifically excluded is research that primarily results in evolutionary improvements to the existing state of practice.
As MTO evolves to address future microsystems-related challenges, the office has identified four thrust areas: (1) Embedded Microsystem Intelligence and Localized Processing, (2) Next Generation Front-End Component Technologies for Electromagnetic (EM) Spectrum Dominance, (3) Microsystem Integration for Increased Functional Density and Security, and (4) Disruptive Defense Microsystem Applications. Each of these overlapping spaces present significant opportunities for exploring new and creative technologies.
Research areas of current interest to MTO include, but are not limited to, the following topics:
 Advanced RF and EO/IR filters and related front-end components
 Advanced imaging architectures and systems
 Advanced photonic & electronic interconnects
 Atomic physics
 Chip-scale sensors
 Cold-atom microsystem component technologies
 Cognitive and other advanced EW technologies
 Compound semiconductor-based electronics and other emerging device technologies
 Computational architectures and algorithms for next generation artificial intelligence (AI)
 Directed energy component technologies, physics of effects, and protection techniques
 Electro-optical/infrared (EO/IR) technologies
 Electronics and micro sensors for harsh environments
 Energy-efficient computing and advanced signal processing
 Hardware assurance, reliability & validation
 Heterogeneous integration/assembly technologies (2D, 2.5D, and 3D)
 High energy lasers
 High power microwave technologies
 Low power electronics
 Low temperature electronics
 Low volume microsystems manufacturing and assembly
 Materials to enable next-generation microelectronics
 Metrology and manufacturing tools for multi-chip, multi-technology packaging
 Microelectromechanical system technology
 Microsystem design & CAD
 Microsystems for position, navigation & timing
 Microsystems for RF/optical transceivers
 Mixed-signal electronics
Multi-domain, integrated tools for virtual prototyping Novel photonic devices
Processing techniques for imaging and spectral recognition Quantum devices
Signal processing algorithms and techniques to reduce hardware requirements Thermal management of microsystems
Other microsystems technology topic areas

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